Crack Mechanisms and Crack Interaction in Thin Films

Authors

  • Mads Krabbe Department of Engineering, Mhanical Engineering, Aarhus University

DOI:

https://doi.org/10.7146/me.v1i1.21125

Keywords:

Thin films, fracture mechanics, channeling cracks, steadystate cracking, elastic mismatch, crack interaction, crack spacing, indentation fracture toughness, Rockwell indentation

Abstract

The report contains a description of the theory for throughsurface channeling crack in thin film systems. Key topics and mechanisms are described including channeling criteria, crack interaction and elastic mismatch in the system. A case of radial cracks spreading from a Rockwell indenter is used to describe how the theory can be used to determine fracture toughness and residual stresses in a thin film.

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Published

2012-03-02

How to Cite

Krabbe, M. (2012). Crack Mechanisms and Crack Interaction in Thin Films. Technical Report Mechanical Engineering, 1(1). https://doi.org/10.7146/me.v1i1.21125

Issue

Vol. 1 No. 1 (2012): Crack Mechanisms and Crack Interaction in Thin Films

Section

Report

License

Reproduction permitted provided the source is explicitly acknowledged.

The authors have all rights to the reports.